nichia sts-da1-2779 nichia corporation specifications for warm white led NT2L757DT pb-f r e e r e f l o w so lder ing a ppli c at io n b u ilt -i n e s d p r ot ec ti on d e vi c e r o hs co mp lia nt http://
n i chia st s-da1- 2779 1 specifica t ions (1) ab sol u te maxi mum r a ti ngs item symbol absolute maximum rating unit forward current i f 300 ma pulse forward current i fp 400 ma allowable reverse current i r 85 ma power dissipation p d 1.05 w operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 120 c * abs o l u te maxi mum r a t i ngs at t s =25c. * i fp co ndit io n s wi th pu ls e wi dth 1 0 m s an d dut y cycl e 10%. ( 2 ) in it ial e l ect r ical/ o pt i cal c h ar acterist ics ite m symbol condition typ max unit forward voltage v f i f =150ma 3.05 - v luminous flux v i f =150ma 61.5 - lm luminous intensity i v i f =150ma 20.6 - cd r 70 color rendering index r a i f =150ma 73 - - luminous flux v i f =150ma 58 - lm luminous intensity i v i f =150ma 19.6 - cd r 8000 color rendering index r a i f =150ma 83 - - x - i f =150ma 0.41 - - chroma ticit y c oordinate y - i f =150ma 0.39 - - thermal resistance r js - 12 18 c/w * char acteristics at t s =25c . * lum i nous f l ux v a l u e as p e r cie 127: 200 7 s t andard . * chrom a t i ci t y coordi nate s as pe r cie 1931 chrom a ti cit y chart . * r js is th ermal r e si sta n ce from juncti o n to t s measur in g point.
n i chia st s-da1- 2779 2 ranks item rank min max unit forward voltage - 2. 6 3. 5 v p16 72. 0 85.6 p15 60. 5 72.0 p14 51. 0 60.5 luminous flux p13 42. 8 51.0 lm r70 r a 7 0 - - r a 8 0 - - color rendering index r8000 r 9 0 - - color r a nks r a nk s w 27 rank sw30 x 0. 4373 0. 4562 0. 4813 0. 4593 x 0. 4147 0. 4299 0. 4562 0.4373 y 0. 3893 0. 4260 0. 4319 0. 3944 y 0. 3814 0. 4165 0. 4260 0.3893 r a nk s w 35 rank sw40 x 0. 3898 0. 3996 0. 4299 0. 4147 x 0. 3670 0. 3736 0. 3996 0.3898 y 0. 3716 0. 4015 0. 4165 0. 3814 y 0. 3578 0. 3874 0. 4015 0.3716 rank sw45 x 0. 3515 0. 3548 0. 3736 0. 3670 y 0. 3487 0. 3736 0. 3874 0. 3578 * r a nking at t s =25c. * f o rw ard v o l t age t o le r a nce: 0. 05v * luminous flux t o ler a nc e: 7% * co lo r r e nde r ing ind e x r a to l e r a n c e : 2 * co lo r r e nde r ing ind e x r 9 to l e r a n c e : 6 . 5 * the r 9 v a l u e for the abo v e r a nk shall be greater tha n 0. * chrom a t i ci t y coordi nate t ol e r a nce : 0 . 005 * led s from the abo v e r a nk s wil l b e shi p p e d. the r a nk combinat ion r a t i o per sh ipmen t will be d e cided by nichia . lum i no us f l ux r a nks by color r a nk , color r e nder ing i n dex r a nk ranking by lum inous flux r a nking by color coordina tes, color r e nder in g index p13 p14 p15 p16 r70 sw 27 r8000 sw 30, s w 35,s w 40, sw45 r 70,r8000
n i chia st s-da1- 2779 3 chroma ticity d i agram sw 2 7 sw 3 0 sw 3 5 sw 4 0 sw 4 5 0.30 0.35 0.40 0.45 0.50 0 .30 0.35 0.40 0.45 0.50 x y \ ?E bl a c kb o d y l o c u s 2580 k 4745 k 4260 k 3710k 32 20k 2 870k
n i chia st s-da1- 2779 4 outline dimensions sts - d a 7-4135c n x xx757d ? no. ( g unit: mm) t h is produc t co m p li es wi th ro hs d i re cti v e. u ? ro hs ? m ?? * ( g unit : mm, to le r a n c e : 0 . 2 ) o protec tio n devi ce ka ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?` ? ? + w silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.018g(typ) 1.42 2.27 cathode anode 0.48 2.6 cathode mark 3 3 2.6 2.6 0. 52 dime n s i o ns do no t i n c l ud e mol d fla s h. ? ? ? ? *
n ichia st s-da1- 2779 5 soldering ? r e co mm end e d r e f l ow sold ering co ndi t io n ( lead -free sol d er) ? r e co mm end e d hand so lde r ing cond it ion temperature 350c max soldering time 3sec max r e c o m m e n d e d s o l d e r i n g p a d p a t t e r n r e com m en ded m e ta l solder s t en ci l apertur e ( g un it : mm) 0.6 1.45 0.95 0.6 0.85 2.3 0.85 0.4 2 2.3 3.15 0.6 1.53 0.69 0.6 0.58 2.3 3.15 * thi s led is desi gned to be refl ow so l d ered on to a pc b . if dip sol d ered , ni ch ia can n ot guar ante e i t s r e l i abi l it y . * r e flow so ld ering mu st not be performed more than twic e. han d sold ering mu st not b e performed more than o n ce. * a v oid r a pid cooling. r a mp down th e temp er ature gr adua lly from th e pe ak tem p er at ure. * n i t r ogen re f l ow s o lde r in g is re c o m m e n ded. ai r fl ow sold ering cond it ions can caus e op ti cal d e gr adat i o n, caused by h e at and / or atmospher e . * since the si l i con e us ed i n t h e en cap s ul at i n g res i n is sof t , do not pre ss on the en caps ulan t re si n. pressure ca n cau s e n i ck s, chip -ou t s , en c a psu l an t de la mi nat i on an d deformation , an d wire br eak s , decrea si ng re li abil i t y . * r e pairing should not be d o ne after th e l e ds ha v e been solder ed. wh en repair ing is u n a v oidable, a double-h e a d solder ing ir on shou ld be u s ed. it should b e confir med b e forehand wh et h e r th e char ac te ri st i cs of th e l e d s wi ll or w i l l not be da maged by repairing . * when sold ering, do not ap ply str e s s to th e le d whi l e th e le d is hot . * when us ing a pick and p l a c e m a ch in e, ch oose an appro p riat e nozzl e f o r thi s produc t . us ing a p i ck -and-p lac e nozz le with a s m al l e r dia m e t er t h an the s i ze of t h e le d's e m it ti ng surfac e wi l l caus e dam a ge to th e e m i t t i ng surface and may als o caus e th e le d not to i l l u m i nate . * the reco mmen ded so lder ing pad pa tter n is d e sign ed for attac h m e n t of the le d w i t h out prob le ms . when preci s e mou n t i ng a c cur a cy is requ i r ed, s u ch a s h i gh-de n s i t y mo unt ing , en sur e tha t th e s i ze a n d shap e of th e pad are suitab le for the circu i t design. * consider fa ctors such as t h e reflow sold e r ing t e m p er atu r e, ha nd sold er ing t e mper at ure, e t c . wh en c h oosi n g th e so l d er . * when fl ux is used, i t should be a ha log e n free flux . en su re tha t th e m a nufac tur i ng pr oces s i s not d e sign ed i n a ma nner where the f l ux wil l co me in conta c t w i t h t h e le ds . * make sure t h at t h er e are n o iss u e s wi th t h e t y pe and a m oun t of sold er that is b e ing used . * all of the el ectrod e pads a r e on th e back sid e of th is pro d uc t ; so lder conne ct ion s wi ll not be ab le to be se en nor confirm e d by a normal visua l i n sp ec ti on. whe n us in g the produ c t , ens u re th at th ere are no is su es with th e sol d er ing cond it io ns. 120sec max pre- hea t 180 t o 200c 260c max 10sec max 60sec max above 220c 1 t o 5c per sec
n i chia st s-da1- 2779 6 t a pe and reel dimensions sts- da7- 4266 nxxx757x ?` / ` tr a iler and l e ader to p co ver ta p e led ? ` 400mm ?` 160mm tr ai le r 160mm m i n ( e m pt y pocke t s) lo aded po ckets ? ? ` e m bo ss ed c a rr i e r t a pe ?? ` ?` f eed dir e ct ion lea d er with o u t t op co ver t ape 400mm mi n 100mm lea d er with to p cov e r ta p e 100mm min ( empt y po c k et ) no . ( g unit: mm) ca thode ma r k 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? l abel 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0 .3 180 +0 -3 -0 1.5 +0.1 ` ??? tap e 4 0.1 1. 75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 0.2 0.05 0.7 0. 1 3.18 0 . 1 3.18 0.1 -0 1 +0 .2 reel siz e : 5000pc s 1 `? 5000 ? * th e t ape packin g met h o d c o mp lies w i t h j i s c 0806 (p ack aging of ele c troni c co mpo n e n ts o n co nt i nuous t apes ) . * j i s c 0806 ?? ?` ?? ? when the ta pe is rewound due t o work i n terruptio n s, no mo r e than 10n should be applied to the em bos s e d c a rrie r t a pe . the led s ma y s t ic k to the to p co ver tape. * g? I ?? ? ? ` ? ` ? ? ??`? ( 10n ) ? led ` ` ? N ? ?
n i chia st s-da1- 2779 7 p a ckaging - t a pe & reel nichia led sts-da7-0006c n x xxxxxx ? label la b e l no . reel ` ?` sea l moistu re-proo f ba g ? ? rohs nxxx xx xx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan typ e lot qty . ym xx xx -rrr pcs rohs nxx xxx xx xxxx led ** *** ** rr r pcs typ e rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ` ? ` desic c ant s ? m o is tu re -pr o of ba gs a r e pa ck e d in c a r d bo a r d bo x e s w i th c or r u ga ted pa rti t i on s . ? K ? ?` ? ?` ? ? ? y ? ? ? ? * ? \ H y ?B ? y * ? Q H n ?? u ? p ? ? ? * using the o r iginal package ma ter i al o r e q u i vale n t in t r an s i t is r e c o mme n d e d . do no t expos e to water. t h e bo x i s no t water-res i s t ant. do no t drop or expos e t h e bo x to extern al fo rces a s it ma y damage the products. pr o d ucts sh ipp e d o n tape a n d r eel a r e p a ck ed in a moistu re-proo f bag. t h ey a r e shipp e d in card bo ard bo xes to p r otect th em fro m exte rnal f orce s during trans p o r ta tio n . * u ? ` ? n ? g o ` y ? if n ot provide d , it w ill n o t be in d i cat e d on t h e l a b e l . * ****** is t h e c u st omer part number . O * ******* ? ? ? fo r d e t a i l s, see "lot number ing code" in t h is d o c u me n t . * ?? ? ? ?? t h e l abel does no t have the rank f i el d fo r un-ranke d produc ts. * ? ? ?
n i chia st s-da1- 2779 8 l o t numbering c o de lot numb er is presented by using th e following alpha n u m er ic cod e . ymxxxx - r r r y - y e a r year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - m o n t h month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx -n ichia's product n u m b er rrr -r ank i ng by color c oordinates, r a nking by lu mi nous fl ux, r a n k ing by color r e nder ing i n dex
n i chia st s-da1- 2779 9 dera ting characteristics n t 2x 757 d s t s -d a 7-44 96 no . derating1 0 10 0 20 0 30 0 40 0 50 0 02 0 4 0 6 0 8 0 1 0 0 1 2 0 (4 7, 30 0) (1 00, 8 2.0 ) derating2 0 10 0 20 0 30 0 40 0 50 0 0 2 0 4 0 6 0 8 0 1 00 12 0 ( 100 , 300 ) duty 10 10 0 100 0 1 1 0 100 30 0 40 0 S allowable forward current ( ma ) ` - S solder te mpe rature(c athode side) vs allowable forward current ? ?- S a m b i en t t e m p e r a t u r e v s a l lo wa ble f o r w a r d c u r r e n t S al l o w a b l e f o r w a r d c u r r e n t ( m a) S a l l o w a b l e f o rw a rd c u rre n t ( m a ) ` ? ?? s o l d er t e m p er a t u r e( cath o d e s i d e ) ( c) ?? a m b i en t t e m p er a t u r e ( c ) ? ` ` du t y r a t i o ( %) ` ` - S d u ty r a ti o v s a llo wa ble f o r w a r d c u r r e n t t a =2 5 c 74 c/ w ja r =
n i chia st s-da1- 2779 10 optical characteristics n t 2 l 757 d n o . s t s -d a 7 -44 4 6 sp e c t r u m 0.0 0. 2 0. 4 0. 6 0. 8 1. 0 400 450 50 0 5 5 0 600 650 700 75 0 8 0 0 r e l a t i v e i l l u m i na n c e ( a . u. ) di r e c t iv i t y 1 90 80 70 60 50 40 30 20 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 k sp e c t r um k r e l a ti v e e m i s s i o n i n ten s i t y ( a. u . ) L wa v e l e n g th ( n m ) ? d ir e c t iv it y ? r a di a t i o n a n gl e 10 . 5 0 0 . 5 1 * ?? a l l ch a r act e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d ar e n o t g u ara n t e e d . 15 0 m a i fp = t a =25c 15 0ma i fp = t a =2 5 c * ? ? r7 0 ? ? th e g r a p hs a b o v e s h o w t h e c h a r a c t e r i s t i c s fo r r 7 0 l e d s o f t h i s p r o d uc t .
n i chia st s-da1- 2779 11 optical characteristics n t 2 l 757 d n o . s t s -d a 7 -44 4 7 sp e c t r u m 0.0 0. 2 0. 4 0. 6 0. 8 1. 0 400 450 50 0 5 5 0 600 650 700 75 0 8 0 0 r e l a t i v e i l l u m i na n c e ( a . u. ) di r e c t iv i t y 1 90 80 70 60 50 40 30 20 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 k sp e c t r um k r e l a ti v e e m i s s i o n i n ten s i t y ( a. u . ) L wa v e l e n g th ( n m ) ? d ir e c t iv it y ? r a di a t i o n a n gl e 10 . 5 0 0 . 5 1 * ?? a l l ch a r act e r i st i c s sh ow n a r e f o r r e f e re n c e on l y a n d ar e n o t g u ara n t e e d . 15 0 m a i fp = t a =25c 15 0ma i fp = t a =2 5 c * ? ? r8 0 0 0 ? ? th e g r a p hs a b o v e s h o w t h e c h a r a c t e r i s t i c s fo r r 8 0 0 0 l e d s o f t h i s p r o d uc t .
n i chia st s-da1- 2779 12 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics n t 2 l 757 d s t s -d a 7-44 48 no . tavf 2. 0 2. 5 3. 0 3. 5 4. 0 - 60 - 4 0 - 20 0 2 0 4 0 60 80 100 1 2 0 ta i v 0.6 0. 8 1. 0 1. 2 1. 4 - 60 - 4 0 - 2 0 0 2 0 40 6 0 80 100 12 0 vfi f 10 10 0 100 0 2 . 0 2 .5 3 .0 3 .5 4 . 0 15 0 40 0 relative luminous flux(a.u.) ??- am b i e n t te m p e r a t u r e v s r e l a t i v e l u m i no us f l u x fo r ward curren t( m a) ifiv 0. 0 0. 5 1. 0 1. 5 2. 0 2. 5 3. 0 0 100 20 0 300 40 0 50 0 r e l a t i v e l um i no u s f l ux ( a . u. ) - fo r w a r d c u r r e n t v s r e la t i v e l u m i no us f l u x f orw a r d c u rre nt ( m a ) R- fo r w a r d v o l t a g e v s fo r w a r d c u r r e n t ? - R amb i e n t t e mp e r a t u r e v s fo r w a r d v o l t a g e ?R forwa r d v o lt a g e( v ) R f o r ward voltage(v) ?? ambient t e m p erature ( c ) ?? a m b i en t t e m p er a t u r e( c ) t a =2 5 c * ?? a l l c h ar ac t e r i s t i c s s h o w n a r e f o r r e f e r e n c e o n l y a n d a r e n o t g u ar a n t eed . t a =25c i fp = 150ma i fp = 150m a
n i chia st s-da1- 2779 13 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics no . nt2l757d sts-da7-4223 taxy 0. 37 0. 38 0. 39 0. 40 0. 41 0 . 3 9 0 . 4 0 0. 41 0. 42 0. 43 -40c 0c 25c 1 00 c x if x y 0.37 0. 38 0. 39 0. 40 0. 41 0 . 39 0. 40 0. 41 0. 4 2 0. 43 20ma 100ma 1 50ma 300ma 4 00m a x y y 1 50m a i fp = ? - ? ambie nt te mperature vs chromaticity c oordinate - ? fo r w a r d c u r r e n t vs c h r o m a ti c i ty c o o r d i n a te t a =2 5 c * ? all characteristics shown are for reference only and are not guaranteed. * ? ? r7 0 ? ? t h e gr a p h s a b o v e s h o w t h e c h a r a c t e r i s t i c s fo r r 7 0 l e d s o f t h i s pr o d u c t .
n i chia st s-da1- 2779 14 for w a r d cur r e n t char acteris t ics / tempera t ure characteristics no . nt2l757d sts-da7-4224 ta x y 0.37 0. 38 0. 39 0. 40 0. 41 0 . 3 9 0 . 4 0 0. 41 0. 42 0. 43 -40 c 0 c 25c 100c x ifxy 0. 37 0. 38 0. 39 0. 40 0. 41 0 . 39 0. 40 0. 41 0. 4 2 0. 43 20ma 150ma 40 0 m a x y y 1 50m a i fp = ? - ? ambie nt te mperature vs chromaticity c oordinate - ? fo r w a r d c u r r e n t vs c h r o m a ti c i ty c o o r d i n a te t a =2 5 c * ? all characteristics shown are for reference only and are not guaranteed. * ? ? r 800 0 ? ? ? t h e gr a p h s a b o v e s h o w t h e c h a r a c t e r i s t i c s fo r r 8 0 0 0 l e d s o f t h i s p r o d uc t .
n i chia st s-da1- 2779 15 reliability (1) t e s t s a n d r e sults te s t reference standard test conditions te s t duration failure criteria # units failed/tested r e si st anc e t o soldering heat (reflow soldering) j e it a ed- 4701 300 30 1 t sl d =260c, 10 s e c, 2refl ows , prec ondit i o n : 3 0 c, 70% r h , 168hr #1 0/ 22 solderability (reflow soldering) j e it a ed- 4701 303 30 3a t sl d =2455c, 5s ec, lead- fr ee sold er( s n- 3. 0ag - 0.5cu) #2 0/ 22 temperature cycle j e it a ed- 4701 100 10 5 - 40c( 30mi n )~25c( 5mi n )~ 100c( 30m i n )~25c( 5mi n ) 100c y c l e s #1 0/ 50 moisture resistance (cyclic) j e it a ed- 4701 200 20 3 25c~65c~-10c, 90% r h , 24hr per cy cle 10c y c l e s #1 0/ 22 high temperature stor age j e it a ed- 4701 200 20 1 t a =100c 1000hours #1 0/ 22 temperature humidity stor age j e it a ed- 4701 100 10 3 t a =60c, r h =90% 1000hours #1 0/ 22 low temperature stor age j e it a ed- 4701 200 20 2 t a =- 40c 1000hours #1 0/ 22 room temperature operating life condi t ion 1 t a =25c, i f =150m a t e st board : see n o tes b e low 1000hours #1 0/ 22 room temperature operating life condi t ion 2 t a =25c, i f =300m a t e st board : see n o tes b e low 500hours #1 0/ 22 high temperature oper ating lif e t a =100c, i f =80m a t e st board : see n o tes b e low 1000hours #1 0/ 22 temperature humidity oper ating lif e 60c, r h =90 % , i f =150m a t e st board : see n o tes b e low 500hours #1 0/ 22 low temperature oper ating lif e t a =- 40c, i f =150m a t e st board : see n o tes b e low 1000hours #1 0/ 22 vibr ation j e it a ed- 4701 400 40 3 200m / s 2 , 100 ~2000~100hz , 4 c ycle s, 4 m i n , each x, y , z 48m i n ut es #1 0/ 22 ele c tro s ta ti c d i scharg e s j e it a ed- 4701 300 30 4 hbm, 2kv , 1. 5 k ? , 100pf , 3pul ses, alterna t ely positi v e or nega tive #1 0/ 22 soldering joint shear streng th j e it a ed - 4702b 002 3 5n , 101s ec #1 0/ 22 no tes: 1) t e st board: fr 4 board t h ic kness = 1.6m m, c o pper la y e r t h ic kness=0. 07m m, r ja 74c/ w 2) measu r ements are p e rformed af ter allo w i ng th e le ds to ret u rn to room te mper a t ure . ( 2 ) f a ilu re c r it eria criteria # items conditions failure criteria forward voltage(v f ) i f =150ma >u.s.l.1.1 #1 lumino us f l ux ( v ) i f =150m a n i chia st s-da1- 2779 16 ca u t ion s (1) stor age conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date stor age after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product c o m p li es wit h j e d e c msl 3 or equiv a lent . se e ipc/j e d e c std - 020 for m o i s t u re- s ens i t i v i t y det a il s. absorbed moisture in le d packages can v aporize and expand during soldering, w h ich can ca use in te rface de lam i na tion and result in optical p e rforman c e degr ad ation . prod ucts are pack e d in moisture-proof alu m inu m bag s to min i mize moistur e abso r ptio n d u ring tr ansporta tion a n d stor age. in c l u d e d s ilic a ge l de si cc ant s ch an ge from bl u e t o re d i f m ois tu re h ad pe n e t r at e d bags. after openin g the moisture-proof alu m inu m bag, the pro d ucts should g o through th e solder ing pro c ess withi n th e r a nge of th e co ndi t ion s s t at ed above. un us e d rema in ing le ds shou ld be s t ored wi th silic a gel de sicca nt s in a hermetically sea l ed co nta i ner , prefer ably th e orig in al mo isture -pr oof bags for stor age. after t h e ?p eriod aft e r op eni n g? s t or age time h a s be en exceed ed or s i l i ca ge l de sicca nts ar e no lo ng er blu e , the products should be b a k ed. baking should only be d one once. customer i s advi s ed to k e ep the leds in a n ai rti g ht co nt ainer w h e n not in u s e. expos u re to a corrosi v e en v i ronment may cause t h e pla t ed me ta l part s of the p r oduct to tarn i s h, w h i c h co ul d adverse ly affect so ld ering a n d optica l char acter i sti cs . it is also recommended to return th e le d s to th e orig inal moistur e p r oof bags and resea l . after assembly and dur i ng use, si l v er p l ating can b e affected by the corrosi v e ga ses emitted by componen ts an d mater i als in close pro x imit y of the l e ds with in an end produ c t, a n d th e gas es e n ter i ng in to th e produc t from the exter n al a t mo spher e . the above should b e take n into cons ider a t ion w he n des i gning . r e sin mat e r i al s, in part i cu l a r , may co nta i n sub s ta nc e s whi c h ca n affe ct s i lver pla t i n g, su ch a s halo gen. do not use s u lfur- c on tai n i n g ma teri als i n commercial products. some mater i als, su ch a s seals and adh esives, ma y co nta i n su lfur . the extre m ely corroded or conta m inat ed plating of le ds mig h t cause a n open ci rcuit. si li co ne rubb er i s recomm end e d as a mater i al for sea l s. bear in mi nd , t h e use of s i l i co ne s may l e ad to si li co ne con t a m i n at ion of e l e c tri c a l con t ac ts inside th e p r oduct s , caus e d by lo w mol e c u lar we igh t vol a ti le si loxane . t o prevent w a ter cond en s a tion , p l eas e avoid large te m p er at ure a n d h u midi t y fl uc tua t ions for th e s t or age condi t io ns. do not stor e th e le ds in a dus t y en viron m en t . d o not expo se the leds to di rect s u n lig ht and/or an e n vironme n t w h er e th e te mp er at ure i s hi gher t h an normal room temp er atur e. (2) di recti o ns for use when de sig n ing a cir c u i t , t h e c u rren t thro ugh ea ch le d mu st no t exc e ed th e abso lu t e maxi mu m r a tin g . oper ating a t a co nstan t cu rrent p e r le d is reco mmen ded. in case of o p er ating at a c onsta nt vo ltag e, c i rcu i t b is r e commende d . if the leds are oper ated w i th con s ta nt voltag e us ing c i r c ui t a, th e curr ent throug h t h e leds may v a ry due to t h e v a riat ion in f orw ard v oltage ch ar acteristics of the leds. (a) ... (b) .. . this product sho u l d b e oper ated using forw ard curre n t . ens u re t h at th e produc t i s no t subj ec ted to either forw a r d or reverse voltag e wh il e i t is no t i n us e. i n parti c u l ar , su bject i ng it to c o nti nuou s reve rse volt age may cause migr a t io n , wh i c h may cau s e damage to t h e led d i e . when used i n d i sp la ys tha t are no t used for a l o ng tim e , the m a i n po wer supp l y sho u l d be switched off for safet y . it is recom m en ded to ope r ate the le ds at a current gr eater t h an 10% of the sorting current to stabilize the le d char acter i stic s. ens u re t h at exces s ive volta g es s u c h as l i g h tn ing surge s are not app l i e d to th e le ds . f o r outdoor use , ne ce ssary mea s ure s sho u ld be taken to prevent wa ter , moi s tur e and sal t air da mag e .
n i chia st s-da1- 2779 17 (3) handl i n g precau ti ons do not hand le t h e l e ds wi t h bare hand s a s it w i ll contam ina t e t h e l ed s u rface and may affect t h e op ti cal char ac ter i st ic s: it mig h t cau s e t h e le d to be deform ed a n d/or t h e w i re to break, w h i c h will c a us e t h e le d not to il l u m i na te . when ha ndl i ng t h e produ c t wi th t w ee zer s , be carefu l n o t to apply exc e ss ive forc e to the r e s i n. otherwis e, the re si n can be cu t, ch ipped, delamina te or deform ed , causing w i re-bo n d breaks an d cata stroph ic fa ilures. dropping th e produc t ma y cause damage. do not sta c k asse mb led p c bs tog e t h er . f a il ure to comp l y can cau s e th e res i n port io n of the produ c t to be cut, ch ip ped, delaminated and/or defor m ed . it ma y cause w i re to break, l e ad ing to catas t roph ic f a il ures . (4) desi gn consi d er ati o n pcb warpag e after moun ti ng th e produc t s on to a pc b c a n cau s e the p a ckage to br ea k. the led s h ould be p l ac ed in a w a y to m i ni mize t h e s t re ss on the l e d s due to pc b bo w and twis t. the positi o n and ori e nta t i o n of the leds affect how much m e cha n i c al stre ss i s exerte d on the led s plac ed near th e score l i n e s . the led s h ould be p l ac ed in a w a y to mi ni mize t h e s t re ss on the l e d s due to board f l ex ing. board separ a tion mu st b e performed us in g spec ia l j i g s , no t u s in g hand s. (5) el ectrostati c di scha r ge (es d ) the produ c t s are se ns it ive to sta t ic e l e c tr i c i t y or surg e voltag e. es d ca n damag e a di e and i t s re l i ab il i t y . when handl i ng t h e produ c ts , th e fol l owi n g mea s ure s ag ains t e l e c tro s t a ti c di sch arge are stron g ly re com m e n ded : e l i m i n a t i n g t h e c h a r g e grounded wri s t str a p , esd footw e ar , clothes, a n d fl oo rs grounded workstat i on equi pm en t and tools esd tabl e/s h e l f ma t ma de o f co ndu c t i v e ma ter i al s ens u r e t h at to o l s (e .g. so ld er ing ir o n s ) , j i gs and m a ch in es t h at ar e be i n g us ed are pr operly ground e d and that proper grounding tech niqu es ar e used in wo rk area s. f o r dev i c e s / equi pm en t tha t mou n t th e le ds , protectio n a g ain s t s u rge voltag es s h ou ld also be us ed. if tools or e q uip m e n t co nt ain i n s u la ti ng mat e ria l s su ch as gla ss or pla s t i c , t h e fol l o wi ng m e as u r es agai n s t el ec t r os t a ti c di sch arge are stron g ly re com m e n ded : diss ipat i n g sta t ic c h arg e wi th co nduc t i ve mat e ria l s preventi ng charg e gen e r a tion w i th m o is ture n e u t r a l i z i n g t h e c h a r g e w i t h i o n i z e r s th e cu st ome r i s advi se d to c h ec k if the leds are da ma ged by esd when performi ng th e c h ar acter i s t i cs in spe c t i on of th e le ds in t h e app l i c at ion. damage ca n be detected with a forw ard v o ltage mea s u r ement a t low curren t ( 2m a) . esd da m a g e d led s m a y ha v e current fl o w at a l o w v o ltage. f a ilur e c r iter ia : v f <2.0 v at i f =1.0ma
n i chia st s-da1- 2779 18 (6) t h ermal manageme nt proper th er mal manage m e nt is a n i m po r t an t when designing prod uc ts with le ds . le d di e t e mp er at ure i s affec t ed by pcb ther mal r e sistan ce and le d spa c ing on th e boar d. pl eas e de sig n produc ts in a w a y that t h e l ed d i e t e mperature does not exceed th e max i mu m j unc t i on t e mper a t ure ( t j ). drive curre nt s h oul d be d e ter m ined for t h e s u rround ing ambi en t te mp er ature (t a ) to dis s ipa t e the h e at from the pr oduct . the fol l owi n g equat i on s ca n be us ed to c a lcu l a t e the ju nct i on te mper a t ure of t h e pro d uct s . 1 ) t j =t a +r ja ? w 2 ) t j =t s +r js ? w * t j =led junc tio n te mp e r ature: c t a = a m b i e nt te mp e r a t ure : c t s =soldering te mper a t ure ( c at hode s i de) : c r ja =th e rm a l resi stance from juncti o n to am b i ent: c/w r js =therm a l resi stance from juncti o n to t s measuring point: c /w w = i n p u t p o w e r ( i f v f ): w ts p oint (7) cl eani ng the leds shoul d no t be cl eaned w i th w a t e r , b e n z i n e , an d/ o r t h i n ne r . if r e quir ed, isopr o py l a l coho l (ip a ) s h oul d be use d . ot he r solven ts may caus e pre m at ure fai l ure to t h e le ds due to the d a mage to th e r e si n port ion . t h e effe ct s of s u ch solve n t s s h ould b e ver i f i ed pr ior to u s e . in additio n , the use of c f c s su ch as freo n is hea v ily regula ted . when du st and/or dir t adh eres to th e le ds , soak a cloth with isoprop y l alco hol (ip a ), then squeeze i t b e fore wiping the led s . ul tr ason ic cl eani ng i s no t recom m e nded s i nc e i t ma y have adverse eff e ct s on t h e l e ds depending on the ultr ason ic power a n d h o w led is assembled. if ultr asoni c clea ni ng m u s t be use d , t h e c u sto m er is adv ised to mak e sure th e le ds w i ll not b e da ma ged prior to cleaning . (8) ey e saf e t y in 2006, t h e interna t i o nal el ec t r i c a l comm is si on (iec ) publi s hed iec 62471: 200 6 phot obi o l o gic a l s a fet y of l a m p s and lamp sy ste m s, wh ic h a dded le ds in it s scop e . on t h e ot her hand, t h e iec 60825- 1: 20 07 l a s e r s a f e t y s t andard r e mo v e d leds from it s sc ope. howev e r , please b e advised that some co untr i es and regions ha v e ado pted stand a rds bas ed on t h e iec l a s e r safet y s t a n dard iec 60825- 1: 20 112001, whi c h s t ill i n cl udes leds i n i t s sc op e. most of n i chi a's leds ca n be cl a s si fied as bel o ng ing in to either the ex empt group or risk group 1. hi gh - p owe r le ds , t h at em it li gh t con t ai ni ng blu e w a vel e ngth s, ma y be cla s sified as risk group 2. please pro c eed wi th cau t io n whe n view in g direc t ly an y leds driv en at high current, o r vi ewing led s with opt i ca l ins t ru me nt s w h ic h may gr eat l y in crease th e damage s to your eyes . view ing a f l ashing ligh t ma y cause ey e d i scomfort. w h e n in cor p or ati n g the l e d in to your pr oduct , please be careful to a v oid adv erse eff e cts on the hu man body caused by ligh t stimu l a t ion.
n i chia st s-da1- 2779 19 (9) ot hers the le d s d e scr ibed in th is brochure ar e i n te nded to be used for ordin a ry e l ec t r oni c equ i pm en t ( s uch as offi ce eq uipm ent, commun i cat i ons equ i pm en t, mea s ure m e n t in str um e n t s and hou s eho l d applia nc es ). consult nichia's sales staf f in adv an ce fo r informa t io n on th e applica t ions in wh ich ex ceptiona l qua l it y and r e liab i l i t y ar e r e q u ir ed , par t i cu lar l y when the f a il ur e or malf u n c t ion of the le ds m a y dir e c t ly j e o par dize lif e or h e a l t h ( s u c h a s f o r a i r p la ne s , ae r o s p ac e, s u bm e r si bl e repeaters, nuc l e ar reactor co ntrol system , a u tom o bil e s, tr affic contr o l equi p m en t, l i fe s u pport sy s t e m s and safe ty devic e s ) . the c u s t om er sha ll not reverse eng i ne er by disas s e m bl i n g or analys i s of the le ds wi t h out ha v i ng pr i o r writt e n co ns ent from nich ia . when def e c t ive le ds are fou n d, t h e c u s t om er sha ll inf o r m ni ch ia dir e c t ly bef o r e di sas s e m bl ing or ana l y s is . the sp ecification s and app ear a nce of th is product ma y change w i thou t notice; nich ia doe s not guar an te e the cont en ts of thi s sp ec ifi c at i o n. bo th t h e c u sto m er a n d n i ch ia will agr e e on the of f i c i al s p ec if ic at ions of suppl ie d pr oduct s bef o r e th e volum e pr odu c t i on of a pr ogr a m begi ns .
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